| 摘要 |
PURPOSE:To improve the mechanical properties of a copper film formed by chemical plating by adding polyamine and pyridyl to a prescribed chemical copper plating bath. CONSTITUTION:About 0.001-0.5mol/l polyamine such as ethylenediamine and about 0.00001-0.025mol/l pyridyl such as alpha,alpha'-dipyridyl are added to a chemical copper plating bath having a composition contg. copper ions, a complexing agent and a reducing agent. The plating bath is preferably made alkaline. When the resulting plating bath is used, a copper film having superior mechanical properties such as superior elongation and tensile strength and a fine appearance can be formed by chemical plating. The elongation and tensile strength of the film are further improved by heat treatment. |
