| 摘要 |
PURPOSE:To reduce a manufacture lead time, improve a yield and improve reliability by a method wherein, after skelton structure wiring are formed, the space of the wiring is filled with a film-type insulator having patterns which are to be filled with the wiring. CONSTITUTION:The space of copper wiring (skelton structure wirings which are composed of X-layer wiring 22 and via-hole conductors 23 formed on the wiring 22) which are formed on a ceramic base board 21 is filled with a polyimide film 26 in which patterns 24 which serve as female dies when the copper wirings are used as male dies are formed by the exposure of an excimer laser and whose surface is coated with adhesive 25 in a depressurizd state. Then a pressure is applied by a thermal press and the adhesive 25 is melted and fluidized and, further, cured. With this constitution, the manufacture lead time of a module and a computer can be reduced, the yield can be improved and the reliability can be improved. |
