发明名称 ELECTRONIC CIRCUIT MOUNTING BOARD
摘要 PURPOSE:To make it possible to supply a large current, miniaturize a board by making its mounting density higher, and enhance a propagation velocity of signals in the electronic circuit mounting board where a plurality of electronic parts are mounted, particularly in relation to the board for power supplying means. CONSTITUTION:In an electronic circuit mounting board in which there is provided on a supporting board 1, a multi-layered wiring structure formed by a plurality of power supply layers 3 and a plurality of signal wiring layers 4 which are insulated from each other by insulating layers 2, and on the board, a plurality of electronic parts 8 are mounted, and then, the power supply wiring layers 3 and signal wiring layers 4 are connected via 5 to the electronic parts 8 as required, the supporting board 1 itself is made to function as a conductor so that the power can be supplied from the back of the power supply wiring layers 3. Also, the supporting board 1 itself is arranged to function dually as one of the power supply wiring layers in order to reduce the number of the wiring layers.
申请公布号 JPH05152505(A) 申请公布日期 1993.06.18
申请号 JP19910308927 申请日期 1991.11.25
申请人 FUJITSU LTD 发明人 ISANE KENJI
分类号 H01L23/538;H05K1/00 主分类号 H01L23/538
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