发明名称 METHOD FOR PEELING PLATING FROM SURFACE OF COPPER OR COPPER ALLOY
摘要 <p>PURPOSE: To easily and efficiently peel an Ni-base or Ag-base plating layer from Cu or Cu-base alloy by heating Cu or Cu-base alloy, having an Ni-base or Ag-base plating layer, up to specific temp. in an oxidizing atmosphere. CONSTITUTION: The waste articles of metallic parts of Cu or Cu-Fe alloy, etc., having a plating layer of Ni-base metal or Ag-base metal on the surface, are heated to 700-1000 deg.C for 3-20min in a heating furnace with oxidizing atmosphere. A layer of copper oxide of extremely brittle material is formed in the boundary zone between the base metal of Cu or Cu-Fe alloy, etc., and the Ni-base or Ag-base plating layer, and the Ni-base plating layer or the Ag-base plating layer can be easily peeled and removed from Cu or Cu-Fe. By this method, the waste articles of Cu or Cu alloy such as Cu-Fe can be recovered and reused as Cu or Cu-Fe alloy in a quality excellent in value in reclaimed use, free from plating metal, such as Ni and Ag.</p>
申请公布号 JPH0885830(A) 申请公布日期 1996.04.02
申请号 JP19940221957 申请日期 1994.09.16
申请人 KOBE STEEL LTD 发明人 NAKAMURA TAKASHI;KUNII KAZUTAKA;OSUMI KENJI;IKEDA RYUKICHI;YOSHIDA EIJI;OKADA HIROFUMI;OGA KIYOMASA;ARAI MOTOHIRO
分类号 C22B7/00;C22B15/00;(IPC1-7):C22B15/00 主分类号 C22B7/00
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