CIRCUIT BOARD, ITS MANUFACTURE, ELECTRONIC DEVICE MOUNTING BODY, PASTE COMPOSITION, AND GREEN SHEET

摘要

PROBLEM TO BE SOLVED: To obtain a glass ceramic multilayer circuit board composed of a conductor section whose main component is copper and an insulator section whose main component is glass which is capable of being sintered at a temperature lower than the melting point of copper through anchor bonding by a method wherein the sintering finish temperature of the conductor section is set higher than a glass softening and flow point but lower than the sintering finish temperature of the glass ceramic. SOLUTION: 63 pts.wt. of boron-silicate glass powder of average grain size of 3μm and softening temperature 820 deg.C, 37 pts.wt. of mullite particles of average grain size of 3μm, and 17 pts.wt. of acrylic binder are compounded and mixed into slurry, and the slurry is applied onto a polyester film with a doctor and dried up for the formation of a green sheet. Holes are provided to the green sheet, and copper paste 2 composed of 97vol.% of reduction copper powder of average grain size 3μm and 3vol.% of silica glass powder of average grain size of 0.5μm is filled into the holes by printing. 50 green sheets are aligned with each other and bonded together by compression. A very small amount of high-melting point glass is added to conductor material so as to restrain copper powder from being sintered, and glass contained in a base material 1 flows into gaps in a copper conductor 2 before the sintering of the copper conductor 2 is finished, whereby an anchor bonding is done.