发明名称 SHEET MOLDING COMPOUND, ELECTRONIC PART, METHOD FOR PRODUCING SHEET MOLDING COMPOUND, AND METHOD FOR PRODUCING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a sheet molding compound which prevents the generation of a void in a molding and can curtail a molding time when the molding in the shape of a plate or a sheet is obtained, an electronic part using the sheet, a method for producing the sheet, and a method for producing the electronic part. SOLUTION: In the method for producing a sheet molding compound 1, after a tablet 2 is manufactured by stamping out a powdered resin composition, the tablet 2, which is heated at a temperature so that its inside has fluidity while its outside shape is kept, is mounted on a sheet molding mold and pressed into a sheet. The electronic part is molded by a method is which the sheet molding compound 1 insert part approximately in the same shape of the insulating layer of the desired electronic part is charged in a molding mold and hot- pressed.
申请公布号 JP2002079536(A) 申请公布日期 2002.03.19
申请号 JP20010046191 申请日期 2001.02.22
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 MIZUSHIMA TAKEFUMI
分类号 B29B9/08;B29C43/02;B29C43/52;(IPC1-7):B29C43/02 主分类号 B29B9/08
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