| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can prevent the end of a semiconductor chip from coming into contact with a wiring pattern, and to provide a method of manufacturing the device, a circuit board, and electronic equipment. <P>SOLUTION: In the method of manufacturing the semiconductor device, the semiconductor chip 40 having electrodes 42 is mounted on a bendable substrate 10 having the wiring pattern 20 in a state that the surface of the chip 40 having the electrodes 42 is faced to the substrate 10. The method includes a step of bending the substrate 10 so that the interval between the chip 40 and the substrate 10 at the end of the chip 40 becomes broader than that at the central part of the chip 40. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
