| 摘要 |
Grid is placed in channels of matrix of beam lead devices cemented with soluble adhesive to plate. Grid-matrix-plate assembly is drawn by vacuum onto first chuck with pattern of apertures at one end. Solvent is forced through first chuck and apertures to dissolve adhesive. Plate is removed and grid-matrix assembly transferred to second chuck which may be porous block operable with vacuum, magnetic block cooperating with magnetic grid, or a combination thereof. Second chuck may also be magnetic block having mesas and cooperating with magnetic grid, non-magnetic block having apertures through mesas operable with vacuum, or combination thereof. After transfer to second chuck, grid is removed and matrix expanded.
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