| 摘要 |
PURPOSE:To eliminate package crack during soaking into solder after absorption of moisture by sealing a semiconductor element using a particular polymaleimide compound, allylic phenol resin, organic peroxide and inorganic filling agent. CONSTITUTION:A semiconductor element is sealed using a resin compound including polymaleimide compound having two or more maleimide groups in the one molecule, allylic phenol resin, organic peroxide and inorganic filling agent. This maleimide compound is expressed, for example, by the equation I. In the equation I, Ar indicates aliphatic group or aromatic group including two or more carbons and an indicates an integer 2 or larger. Moreover, the allylic phenol resin is expressed by the equation II. In the equation II, R indicates -CH2-CH=CH2 group, -H, alkyl group, allyl group, etc. Thereby, a semiconductor device which is superior in the anti-crack property and reliability to moisture proof characteristic during soaking into the solder can be obtained. |
