Fluxless soldering esp. flip-chip bonding apparatus

摘要

In an apparatus for fluxless soldering of photonic components onto a substrate in a radiant heated, quartz glass vacuum chamber having a gas feed line, a work holder and a controller, the novelty is that (a) the vacuum chamber (2) is a flat chamber having a quartz glass plate bottom (3) and a removable quartz glass plate lid (4); (b) radiant heating is provided by a focussed IR radiant heater (5) located directly under the chamber bottom (3) and directly aligned with the substrate (6); (c) the holder consists of an external upper adjustment device (26) for holding and positioning a photonic component (esp. in the form of an IR-transparent flip-chip, 18) and an external lower substrate adjustment device (7) which does not hinder the radiant heating; and (d) the controller has an in-situ adjustment monitoring device for automatic adjustment of the flip-chip (18) on the substrate (6), the device being an IR microscope (28) which can be positioned above the chamber lid (4).