| 摘要 |
<p>The invention concerns electronic modules with semiconductors, with liquid-cooling system, said module comprising a fixed part consisting of a cooling device (M1) and a plug-in unit (M2) on the fixed part. Said cooling device comprises a truncated base (C) wherein circulates a heat transferring liquid (F). The plug-in unit (M2) comprises a metal block (D) whereon are pressed electronic circuits to be cooled. Said block has a recess (E) with the same truncated profile as the base. When the unit is plugged in the recess walls and the base are in contact. The invention is applicable, in particular, to power transmitters.</p> |
