发明名称 PHENOLIC RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a phenolic resin molding material which has high mechanical strengths, good electrical insulating properties and excellent sliding characteristics. SOLUTION: The phenolic resin molding material comprises, as essential ingredients, a resol resin (A), a novolak resin (B) and a fine tetrafluoroethylene resin powder (C), and contains 30-50 pts.wt. of the resol resin (A), 5-15 pts.wt. of the novolak resin (B) and 0.1-40 pts.wt. of the fine polytetrafluoroethylene resin powder (C) based on the whole molding material, the resol resin (A) being a methylene-linked resol resin and/or a dimethylene ether-linked resol resin, the novolak resin (B) having a number average molecular weight of 1,000-1,500.
申请公布号 JP2000226496(A) 申请公布日期 2000.08.15
申请号 JP19990029550 申请日期 1999.02.08
申请人 TOSHIBA CHEM CORP 发明人 NAKAJIMA YUKINORI;AKIMOTO HIROSHI;ASAMI KENJI
分类号 C08L61/08;(IPC1-7):C08L61/08 主分类号 C08L61/08
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