发明名称 METHOD MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To stably maintain an opening formed in an insulating resin layer with a desired diameter for a long time by reducing the illuminance drop of a discharge lamp for exposure having a bulb length that falls within a specific range by forming a photosensitive resin layer on a lower-layer conductor circuit and, at the same time, exposing the photosensitive resin layer to the light emitted from the discharge lamp. SOLUTION: A discharge lamp 7 for exposure has a bulb length of 90-250 mm and a bulb diameter of 90-150 mm. In such a bulb length of the lamp 7, the length can reduce the illuminance variations of between discharge lamps 7 and the illuminance drop of the lamp 7 resulting from foreign maters adhering to the internal surface of the bulb of the lamp 7 and assures the effect of the impurity removing material incorporated in the lamp 7. In the discharge lamp 7 of such and arrangement, the photosensitive reactions of a photosensitive resin, a resin for forming photosensitive solder resist, and a photosensitive dry film become appropriate and openings having desired diameters and wiring can be formed and stably maintained for a long time, because the variation of the exposing factor, such as the wavelength, illuminance, etc., of the light source is reduced regardless of the used time.
申请公布号 JP2001053445(A) 申请公布日期 2001.02.23
申请号 JP19990226486 申请日期 1999.08.10
申请人 IBIDEN CO LTD 发明人 KITAJIMA KAZUHISA;MATSUBARA SHIGEJI;NIKI NORIO;SUZUKI AYUMI
分类号 H05K3/28;H05K3/00;H05K3/42;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/28
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