发明名称 POLYPROPYLENE RESIN EXTRUDED FOAM BOARD
摘要 PROBLEM TO BE SOLVED: To provide a polypropylene resin extruded foam board which has a low density and a low closed cell ratio, a small average cell diameter, and is soft and of a low thermal conductivity due to the thickness, and can be suitably used for, e.g. heat insulation of a bending part or sound insulation. SOLUTION: The extruded board can be obtained by mixing a mixed resin obtained by mixing (a) 50-95 pts.wt. polypropylene based resin, (b) 50-5 pts.wt. polystyrene based resin, and (c) 0.1-15 pts.wt., based on 100 pts.wt. component (a) plus component (b), hydrogenated styrene/isoprene/styrene block copolymer and a blowing agent in an extruder, and pressuring the resulting mixture into a low pressure zone, and has a density of 50-10 kg/m3, a closed cell ratio of <60%, an average cell diameter of <=1.2 mm, and a thickness of >=15 mm.
申请公布号 JP2001329098(A) 申请公布日期 2001.11.27
申请号 JP20000150228 申请日期 2000.05.22
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 OKURA TETSUO;MIYAMA OSAMU
分类号 C08J9/12;C08F8/00;C08L23/26;(IPC1-7):C08J9/12 主分类号 C08J9/12
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