SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device, in which a terminal part can be arranged with a spatial margin by securing the arranging area of a terminal part. SOLUTION: In this semiconductor device 20 mounting a spherical semiconductor element 21 on a substrate 25, the semiconductor element 21 has a plurality of terminal parts 22 formed on its peripheral surface, and is partially or entirely buried in the substrate 25. The substrate 25 has a plurality of layers of wiring patterns 28 laminated via an insulating layer 27, the wiring patterns 28 are connected electrically with the terminal part 22 of the semiconductor element 21 and led out to the surface of the substrate 25 directly or via a via 30. Fixing materials 32 for external connection are formed at the exposed parts of the patterns 28.