发明名称 COPPER FOIL WITH RESISTANCE LAYER AND PRODUCTION METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide copper foil provided with a resistance layer which has a high sheet resistance value, and is hardly dissolved simultaneously with copper, and to provide a production method therefor. SOLUTION: The copper foil with a resistance layer is used so as to be laminated with an insulating base material, and at least one side has a surface roughness of 3 to 6μm by a 10 point average roughness prescribed by JIS B 0601. A resistance layer consisting of an electrically conductive material having an electrical resistivity of 0.05 to 2μΩm at 298K is formed on one side or both sides of the substrate copper foil to a thickness of 10 to 300 mg/m<SP>2</SP>. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003193291(A) 申请公布日期 2003.07.09
申请号 JP20010401407 申请日期 2001.12.28
申请人 FURUKAWA CIRCUIT FOIL KK 发明人 TANI TOSHIO
分类号 H05K1/09;C23C28/00;C25D7/06;(IPC1-7):C25D7/06 主分类号 H05K1/09
代理机构 代理人
主权项
地址