| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which has a build-up layer only on one side (the surface) of a core substrate and the whole body of which including the build-up layer does not warp, but is maintained in a flat state, and to provide a method of manufacturing the wiring board. SOLUTION: This wiring board 1 includes the core substrate 2 having the surface 2a and a rear surface 2b, surface wiring layers 10 formed on the surface 2a of the substrate 2, and the build-up layer BU composed of pluralities of insulating layers 14 and 20 and wiring layers 18 and 24 alternately formed on the surface 2a of the substrate 2. This wiring board 1 also includes rear- surface wiring layers 11 which are formed on the rear surface 2b of the substrate 2b and thicker in thickness than the surface wiring layers 10. COPYRIGHT: (C)2003,JPO |
