发明名称 MOTHER DIE FOR ELECTROFORMING AND METHOD FOR PRODUCING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a mother die for electroforming for making inexpensive, mass-producible supports in which the rate of condensing is high and the holing precision of through holes is high regarding the mother die for electroforming for producing ragged-shaped plated articles usable for a photodetector condensing plate, a spherical crystal solar battery reflecting mirror, a reflecting mirror, a light guide plate or the other apparatuses, and a method for producing the same. <P>SOLUTION: In the mother die for electroforming, recessed shapes are repeatedly arranged, the bottom of each recessed shape is provided with a through hole, and the through hole is filled with a filler. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006111954(A) 申请公布日期 2006.04.27
申请号 JP20040303245 申请日期 2004.10.18
申请人 PROCESS LAB MICRON:KK 发明人 OTSU TAKAKI;IWASAKI KOTA;CHIBA HIDEKI
分类号 C25D1/10;C25D1/00;H01L31/042 主分类号 C25D1/10
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