| 摘要 |
1488386 Semi-conductor devices SEMIKRON GESELLSCHAFT FUR GLEICHRICHTERBAU UND ELEKTRONIK mbH 4 Oct 1974 43047/74 Heading H1K A semi-conductor rectifier arrangement has at least one rectifier element 22 on a cooling device consisting of a metallic base 1 and a cover 10 of insulating material of high thermal conductivity which define a coolant channel 10a, and ports 2 for the influx and efflux of coolant, the cover 10 having, adjacent the coolant channel 10a, a sub-divided metallic layer 11 on which the rectifier 22 is secured in electrical and thermal contact, the other contact face of the rectifier element 22 being in electrical and thermal contact with a current conductor 24 secured to an adjacent part of the metallic layer 11 to form an electrical and thermal contact therewith. The conductor 24 may, in an alternative embodiment, extend between two further subdivided parts of the same metallic layer part 11. The rectifier element 22 may be encapsulated in silicon rubber (36), Fig. 4 (not shown) in a metal cup (35) and the entire assembly may be enclosed in encapsulation (31) within a cover (30). |
