PROCESS FOR ELECTROFORMING COPPER FOIL

摘要

A method for preparing a copper foil is described. A continuous strip of com. Al or Al alloy is prepd. for the Cu electrodeposition. There is lst a room temp. etch in NaOH, the strip runs at 60cm/min. the 2nd step is a very fast wate rinse and then a zincate dip for 20 sec. A quick cond. H2O rinse follows prior to a l min dip in a 2.5% HNO3 bath foll owed by a final rinse before the cu electroplating bath. An acid bath was used at room temp. and c.d. of 0.11A/cm2 to deposit a 7μm thick foil.