| 摘要 |
Process for the manufacture of a ceramic substrate 1 which has electrical connection studs 11 passing through the thickness of the substrate. According to this process the holes are produced during the moulding operations, the connection studs 11 are cast in the holes 10 of the substrate 1 and the whole unit is sintered in a single operation. The invention can be employed in new electronics industry techniques for the manufacture of substrates of components such as integrated circuits, display screens and the like. <IMAGE>
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