Semiconductor integrated circuit device having pads at periphery of semiconductor chip.

摘要

For increasing the number of pads to be connected to external terminals such as leads of a lead frame without increasing an area of a semiconductor IC chip (10) , pads (11a, 11b) are disposed at a periphery of the chip in such a manner that they are arranged in at least first and second rows, to which at least first and second groups of interconnection layers (14a, 14b) insulated through an interval insulator are electrically connected, respectively.