发明名称 FORMING METHOD OF INTERMEDIATE INSERTION LAYER ON METAL SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To eliminate need of forming a multi-layer film between a metal substrate and a superconductive film, and enable manufacture without using hydrogen. SOLUTION: An intermediate insertion layer is manufactured by vaporizing rare earth metal of which oxide has a type-C rare earth structure to react with oxygen to be biaxially oriented, and depositing it on a biaxially oriented metal substrate. Deposition of the rare earth metal is performed by vaporizing the rare earth metal by an electron beam, for example, and this vaporization is performed at surface temperature of the metal substrate of 450 deg.C or more and within the temperature range under the lower one of melting temperature of rare earth metal oxide and melting temperature of the metal substrate, with total atmospheric pressure within a range of over 1×10<-6> Torr and 1×10<-3> Torr or under, and within a temperature and oxygen partial pressure range where the rare earth metal is oxidized, but not the metal substrate.
申请公布号 JPH11111079(A) 申请公布日期 1999.04.23
申请号 JP19970268918 申请日期 1997.10.01
申请人 CENTRAL RES INST OF ELECTRIC POWER IND;TOKAI UNIV 发明人 ICHINOSE ATARU;AKITA MITSUGI;TACHIKAWA KYOJI;KIKUCHI AKIHIRO
分类号 C30B29/22;H01B12/06;H01B13/00;H01L39/02;H01L39/24;(IPC1-7):H01B12/06 主分类号 C30B29/22
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