| 摘要 |
PROBLEM TO BE SOLVED: To obtain an IC chip transfer system and an IC chip mounting system, which are simple in constitution but capable of causing less damages to an IC chip. SOLUTION: Dummy bumps 43 are formed on an active surface 42 of an IC chip 41 before an IC chip 41 is transferred. A lower end 44a of a chucking collet 44 is brought into contact with the dummy bumps 43 and sucks up the IC chip 41 so as to hold it. By this setup, while the chip 41 is being transferred, the chucking collet 44 is prevented from coming into contact with the active surface of the active surface of the chip 41, so that the IC chip 41 is less damaged.
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