发明名称 METHOD AND APPARATUS FOR PLASMA SURFACE TREATMENT
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for a plasma surface treatment that enhance flexibility in surface treatment by providing in a plasma treatment chamber two continuous constructions each of which includes a drum electrode rotatably mounted to adapt a film sheet-like material to be treated to follow the outer periphery surface thereof and a plurality of arranged electrodes disposed to confront the drum electrode and bringing one surface of the material to be treated in contact with one of the two drum electrodes and the other surface of the material to be treated in contact with the other one thereof. SOLUTION: A material W to be treated is continuously passed and traveled into a plasma treatment chamber 1 under an atmosphere displaced with a gas for plasma excitation. A voltage is applied between each of two drum electrodes 7 and 7 rotatably mounted to adapt the material W to be treated to follow the outer periphery surface thereof and a plurality of arranged electrodes 8... disposed to confront the respective drum electrodes so as to provide a gap R for the passage of the material W along the outer periphery surface thereof. Then, the surface treatment of the material W to be treated is carried out with a plasma generated between the electrodes 7 and 8 while the material W is being passed and traveled through the gap R. Each surface of the material W to be treated is continuously subjected one after the other to the surface treatment through one drum electrode 7 which one surface of the material W to be treated is adapted to follow and the other drum electrode 7 which the other surface thereof is adapted to follow.
申请公布号 JP2001002806(A) 申请公布日期 2001.01.09
申请号 JP19990174631 申请日期 1999.06.21
申请人 UENO TEKKUSU KK 发明人 UENO MUNEMASA;YUNAMOCHI MASAYUKI;KANI KENICHI
分类号 C08J7/00;B29C71/04;B29L7/00;(IPC1-7):C08J7/00 主分类号 C08J7/00
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