| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit (test chip) for quantitatively evaluating an effect which is exerted on the semiconductor integrated circuit by filling materials being contained in a sealing resin. SOLUTION: A filling material capture dam 11 is formed on a protective film 4 of an active element of a circuit which can make a test of electrical characteristics and a function, whereby filling material capture slits 12 are provided in the dam 12 to contrive to make it possible to efficiently capture filling materials 8. |
