发明名称 METHOD OF MANUFACTURING CCD IMAGE PICKUP ELEMENT
摘要 PROBLEM TO BE SOLVED: To easily detect the resistance change of metallic wiring occurred in a CCD image pickup element, and easily specify the cause of deterioration of transfer. SOLUTION: The metallic wirings 70, 72, 74, and 76 of a CCD image pickup element are led out of itself, and the leads are provided with electrode pads 70A, 72A, 74A, and 76A. The electrode pads 70A, 72A, 74A, and 76A are ones for bringing a tester terminal into contact with themselves, and monitor currents are supplied to the wiring within the CCD image pickup element through these electrode pads 70A, 72A, 74A, and 76A so as to enable it to be used as a wiring resistance monitor. It can be judged easily whether the transfer deterioration of the CCC image pickup element is caused or not by the change of wiring resistance by measuring the wiring resistance, using the CCD image pickup element for monitoring the wiring resistance, in case that transfer abnormality occurs in the CCD image pickup element.
申请公布号 JP2001339058(A) 申请公布日期 2001.12.07
申请号 JP20000157001 申请日期 2000.05.26
申请人 SONY CORP 发明人 IWAMI YASUHIRO
分类号 H01L27/148;H01L27/14;H04N5/335;H04N5/359;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/148
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