| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head with high productivity enabling prevention of short circuit between solders connecting a head substrate and a wiring substrate. SOLUTION: The thermal head consists of a head substrate 1 comprising a ceramic substrate 2 on which plural heating resistors 4 and plural circuit conductors 5 are formed, and a wiring substrate 6 containing plural wiring conductors 7, where a protrusion 8 is formed on the surface of the ceramic substrate 2 and a lead parts led from the circuit conductors 5 are formed on the surfaces of the protrusion and the ceramic substrate around the protrusion. The wiring substrate 6 is placed on the protrusion 8 to have a space between the head substrate 1 and the wiring substrate 6, which is filled with solder 9 to join the lead parts of the circuit conductors 5 to the wiring conductors 7.
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