| 摘要 |
PURPOSE: A fabrication method of multi-level reticle is provided to simplify manufacturing processes of a dual-damascene structure on a wafer and to decrease the number of processes by using bi-level photoresist. CONSTITUTION: A reticle is formed by the following steps. A reticle blank(50) is formed, wherein the reticle blank(50) includes a quartz layer(52), an APS(Attenuation Phase Shift) layer(54) and a metal film(56). Then, a resist layer is coated on the reticle blank(50). Then, the resist layer is patterned into a plurality of levels so as to form a multi-level resist pattern(58). The reticle blank(50) is etched in accordance with the multi-level resist pattern(58). |
