| 发明名称 |
METHOD FOR MANUFACTURING ALUMINUM PLATE, ALUMINUM PLATE, COLLECTOR FOR STORAGE DEVICE, AND STORAGE DEVICE |
| 摘要 |
An object of the present invention is to provide a method for manufacturing an aluminum plate which is simple, is high in productiveness, allows the use of arbitrary aluminum materials, and can be suitably used for collectors having excellent adhesiveness to active material layers, a collector for a storage device, and a storage device. The method for manufacturing an aluminum plate of the present invention is a method for manufacturing an aluminum plate having an aluminum substrate having a plurality of through holes in a thickness direction, including an oxidized film-forming step of forming an oxidized film by carrying out an oxidized film-forming treatment on a surface of the aluminum substrate having a thickness in a range of 5 μm to 1,000 μm and a through hole-forming step of forming through holes by carrying out an electrochemical dissolution treatment after the oxidized film-forming step. |
| 申请公布号 |
US2016294002(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201615187057 |
申请日期 |
2016.06.20 |
| 申请人 |
FUJIFILM Corporation |
发明人 |
MATSUURA Atsushi;KASUYA Yuichi;KAWAGUCHI Junji;HOTTA Hisashi;HOTTA Yoshinori;KOMATSU Hiroshi;SAWADA Hirokazu |
| 分类号 |
H01M10/0525;C25D11/20;C25D11/24;H01G11/70;H01M4/66;H01M4/80;H01G11/68;H01G11/84;C25F3/04;H01M4/04 |
主分类号 |
H01M10/0525 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing an aluminum plate having an aluminum substrate having a plurality of through holes in a thickness direction, comprising:
an oxidized film-forming step of forming an oxidized film by carrying out an oxidized film-forming treatment on a surface of the aluminum substrate having a thickness in a range of 5 μm to 1,000 μm; and a through hole-forming step of forming through holes by carrying out an electrochemical dissolution treatment after the oxidized film-forming step. |
| 地址 |
Tokyo JP |
