METHOD OF MANUFACTURING MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board which can prevent the warp and deformation of a wiring board and can effectively suppress the lateral shrinkage of a constraint sheet. SOLUTION: The method of manufacturing a multilayer wiring board comprises a process of forming a wiring circuit layer 3 on the surface of a green sheet 1 containing ceramic powder comprising silicon oxide powder and glass powder, and then laminating a plurality of the green sheets 1 to form a laminate; a process of laminating the constraint sheet 8 containing forsterite and amorphous components on at least one surface of the laminate to form a molded body; a process of baking the molded body at a melting point or lower of the wiring circuit layer 3; and a process of removing the constraint sheet 8 formed on the surface.