| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated memory device using a BGA package. SOLUTION: BGA packages are laminated into a laminated memory device. The laminated memory device comprises a first BGA package 3 and a second BGA package 3 each having ball bumps 2, a first laminating board 4 and a second laminating board 5 each containing a wiring pattern and connected to the ball bumps 2, connecting boards 6 which are provided between the laminating boards 4 and 5 and connect the wiring patterns contained in the laminating boards 4 and 5, and ball bumps 7 which are provided on the surface of the second laminated board 5 confronting the second BGA package mounting surface and connected to the wiring pattern contained in the second laminating board 5.
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