| 摘要 |
PROBLEM TO BE SOLVED: To reduce damage to an IC chip and a circuit board caused by ultrasonic vibration. SOLUTION: In this ultrasonic flip chip mounting method, a sharp-pointed bump formed on an electrode of an IC chip is positioned at an electrode of the circuit board for ultrasonic bonding. A pressurizing force of the bump for the electrode of the circuit board is increased over time, meanwhile the amplitude of ultrasonic vibration applied to a joint part is decreased in proportion to the increase of the pressurizing force. COPYRIGHT: (C)2003,JPO
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