| 摘要 |
PURPOSE:To establish the semiconductor device small in size, which connects the both sides of the semiconductor element. CONSTITUTION:Taking an example as mounting solar cell having the both sided electrode, the solar cells 11, 12 and 13 having the both sided electrode are connected to the metal wiring lead pattern 19 formed on the substrate 20 made of flexible polyimide film and glass-epoxy resin and the like with the bonding part 18, by means of conductive adhesives, soldering and so on, for the one side electrode to which no sun rays are incident. Further, other electrodes 14, 15 and 16 to which sun rays are incident for the solar cells, are connected to the metal wiring lead pattern 19 with the bonding part 17, by means of thermal pressing, soldering and conductive adhesives and the like. Thus, the metal wiring leads connected to one side of the semiconductor element or elements are connected to other one side of other semiconductor elements. |
