| 摘要 |
1. An assembling device for power electronic components on a heat sink unit comprising this latter and an assembly of supports for power components mounted on the unit and providing the heat transmission from the power components to the heat sink, characterized in that each support is formed by an entirely metallic plate (2) directly bearing the power components (3) and electrically connected by a connection surface portion to a supply source for the power components, and in that the metal plates (2) between which are connected the said power components are wedged in grooves (12) formed in said heat sink unit, each plate (2) being wedged by means of a wedging and isolating member (5, 6) together with a thin electrically isolating and heat transmitting sheet (4) interposed between said plate (2) and a wall of the groove (12). |
