SURFACE MOUNTED DECOUPLING CAPACITOR

摘要

MFP/M-482-1 SURFACE MOUNTED DECOUPLING CAPACITOR L. William Menzies, Jr. Stephen W. Menzies A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contact press-fitted into a pair of apertures in a pair of integral tabs extending from the board. The auxiliary board and capacitor height is not more than about 0.070 inches. The plug-in contact are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board with its attached capacitor is sandwiched between a surface of a printed circuit board having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package. At least two leads of the DIP package are inserted into the pair of insertable contacts in the auxiliary insulative board while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board. In one embodiment, other DIP leads pass through clearance holes in a second pair of integral tabs. Another embodiment provides for redundant capacitors each connected to separate pairs of contacts on the auxiliary board for interconnection of two ground leads and two power leads of the DIP to respective PC board sockets.