| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board at a high quality wherein influences of the resin viscosity of a prepreg sheet and formation facilities are dissolved, while a connection resistance of a double-sided circuit board and a multilayer board in the case of using the prepreg sheet having a small compressibility is stabilized. SOLUTION: A method for manufacturing the circuit board comprises the lamination step of overlapping the prepreg sheet and a metal foil, the compression step of heating in a fixed time period at a temperature near a softening point of the resin, and the formation step of adhering the prepreg sheet to the metal foil to cure. Thus, the connection resistance of the interlayer of the prepreg sheet at a small compressibility having a conductive hole filled with a conductive paste is stabilized to provide the circuit board of a high quality. COPYRIGHT: (C)2005,JPO&NCIPI |
