| 摘要 |
PROBLEM TO BE SOLVED: To provide a retaining ring and a chemical mechanical planarization system (CMP).SOLUTION: In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, where the inner diameter wall is polished to a roughness average (R) less than about 30 microinches (μin).SELECTED DRAWING: Figure 3 |
