发明名称 ULTRASONIC WAVE WIRE BONDING DEVICE
摘要 PURPOSE:To accomplish an oblique-directioned bonding and to simplify an automatic sample-feeding mechanism by a method wherein a slit is provided at the front surface of a tool and the wire is guided with the slit. CONSTITUTION:When the tool 12 is positioned on a bonding point 1a, the tool 12 comes in contact with the bonding point at the set pressure by means of the working of a cam, an ultrasonic wave is transferred and the wire 3 is bonded 3a. Simultaneously with the start of the ultrasonic wave oscillation, a wire guide 40 is lowered to the position adjacent to the bonding point 1a. When the bonding 3a is completed, a rest is shifted, the tool 12 is positioned above the next bonding point 1b and the guide 40 is shifted horizontally together with the tool in the lowered position. At this time, the wire 3 is guided to the slit 40a on the guide 40. Then immediately before the wire is pressure-welded to the point 1b, the wire is separated from the guide 40, but as it is pressed immediately after that, the wire is held in the slit of the tool. After that a clamper 13 is shifted toward the wire and the wire is cut. In this constitution, the rotation of the sample is unnecessary even when the direction of wire distribution is diagonal to the upper side than the inserted direction and a wire bonding can be performed with a simple mechanism.
申请公布号 JPS5681948(A) 申请公布日期 1981.07.04
申请号 JP19790145950 申请日期 1979.11.10
申请人 SHINKAWA KK 发明人 SUZUKI YASUNOBU;TAKAMURA TOORU
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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