| 发明名称 | Electronic device with redistribution layer and stiffeners and related methods | ||
| 摘要 | An electronic device may include an integrated circuit (IC), electrically conductive connectors coupled to the IC, and a heat sink layer adjacent the IC and opposite the electrically conductive connectors. The electronic device may include an encapsulation material surrounding the IC and the electrically conductive connectors, a redistribution layer having electrically conductive traces coupled to the electrically conductive connectors, a stiffener between the heat sink layer and the redistribution layer, and a fan-out component between the heat sink layer and the redistribution layer and being in the encapsulation material. | ||
| 申请公布号 | US9466550(B2) | 申请公布日期 | 2016.10.11 |
| 申请号 | US201514741535 | 申请日期 | 2015.06.17 |
| 申请人 | STMICROELECTRONICS PTE LTD | 发明人 | Luan Jing-En |
| 分类号 | H01L23/48;H01L23/373;H01L23/498;H01L23/367;H01L23/31;H01L21/48;H01L23/00 | 主分类号 | H01L23/48 |
| 代理机构 | Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A. | 代理人 | Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A. |
| 主权项 | 1. An electronic device comprising: an integrated circuit (IC); a plurality of electrically conductive connectors coupled to said IC; a heat sink layer adjacent said IC and opposite said plurality of electrically conductive connectors; an encapsulation material surrounding said IC and said plurality of electrically conductive connectors; a redistribution layer having a plurality of electrically conductive traces coupled to said plurality of electrically conductive connectors; a stiffener between said heat sink layer and said redistribution layer; and a fan-out component between said heat sink layer and said redistribution layer and being in said encapsulation material. | ||
| 地址 | Singapore SG | ||