| 摘要 |
PURPOSE:To realize an integrated circuit device, by which a multilayer wiring can be avoided and a reduction of the number of manhours, an improvement of the yield and a prevention of the lowering of reliability due to insulation failure can be contrived, and at the same time, connections can be performed easily and accurately at lower costs, and moreover, a wiring area can be also reduced, by a method wherein a control wiring for integrated circuit chips is provided under the integrated circuit chips of the integrated circuit part. CONSTITUTION:An electrical connection of the IC chips 4 and the heat generating part 2 of a heat-sensitive recording head 20 is performed by a film-carrier tape 17, which has been bridged over between a printed substrate 5 and a resistor plate 3 over a gap 6, and the IC chips 4 are wire-bonded to a wiring 12 provided on the printed substrate 5 in a prescribed pattern. Meanwhile, a control wiring 12' for the IC chips 4 is provided on the lower side of the IC chips 4 themselves and the wiring 12' is connected to the IC chips 4 by performing a wire-bonding on each bonding pad mounted in a face-up type of the IC chips 4. Accordingly, the control wiring 12' and the IC chips 4 can be connected without adopting a film-carrier system, and also, without making into a multilayer wiring structure. |
