| 摘要 |
PURPOSE:To enable correct alignment to be performed while eliminating the need of sealing jigs, by utilizing a cap provided with holes so that external leads are inserted through the holes and by setting the cap with the external leads inserted through the holes. CONSTITUTION:A semiconductor element 12 is carried and fixed on the semiconductor element carrying section in a ceramic substrate 1. The electrodes of the element 12 are connected to the electrodes of inner leads of the substrate 1 with metallic small-gauge wires 13. Each external lead 6 brazed to the substrate 1 is inserted through a through-hole 8 provided in a cap 7 and the cap 7 is set and sealed by melting sealing glass 9. Since the roots of the external leads are caught by the sealing glass, the strength of fixing the leads is improved. Further, the material cost can be reduced since Au-Sn or the like is not used for brazing. |
