| 摘要 |
PURPOSE:To easily mount the I/O terminals of an integrated circuit element on a circuit board even if the terminals have a narrow pitch, microscopic size and multi-terminals by forming an electrically connecting conductive layer on a polymer material layer formed between the electrodes of the element and the wiring layer of the board by using an energy beam. CONSTITUTION:After an integrated circuit element 103 is secured to a circuit board 101 with adhesive 105, a polymer material 106 is formed in a crest between the board 101 and the element 103. After the material 106 is solidified, a conductive layer 108 is formed on the material 106 and the board 101 between a layout wiring layer 102 and a pad 104 by using an energy beam 107. A conductive layer 108 is formed on the part of the surface of the board 101 made of the polymer material, and a layer of the polymer material is formed all between the pad 104 and the layer 102. Thus, an electric connection is improved.
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