发明名称 |
Sputtering apparatus, device for exchanging target and method for the same |
摘要 |
In accordance with the present invention, in order to exchange a target under a vacuum condition without communicating a film-forming chamber with the atmosphere for exchange of the target, a substrate is located in a vacuum vessel and an opening portion is provided on a wall surface of the vacuum vessel opposite to the substrate which is formed with a thin film on its surface. A target exchanging chamber is disposed adjacent to the vacuum vessel so as to be communicated therewith through the opening portion. During film-formation, the interior of the vacuum vessel is maintained in a vacuum state by closing the opening portion with the target while the target exchanging chamber is communicated with the atmosphere and a spare target is contained therein. When exchanging the target, the air in the target exchanging chamber is exhausted to maintain the chamber in a vacuum state and the target is replaced with the spare target.
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申请公布号 |
US5429729(A) |
申请公布日期 |
1995.07.04 |
申请号 |
US19900616868 |
申请日期 |
1990.11.21 |
申请人 |
HITACHI, LTD. |
发明人 |
KAMEI, MITSUHIRO;SETOYAMA, EIJI |
分类号 |
C23C14/34;C23C14/56;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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