发明名称 Sputtering apparatus, device for exchanging target and method for the same
摘要 In accordance with the present invention, in order to exchange a target under a vacuum condition without communicating a film-forming chamber with the atmosphere for exchange of the target, a substrate is located in a vacuum vessel and an opening portion is provided on a wall surface of the vacuum vessel opposite to the substrate which is formed with a thin film on its surface. A target exchanging chamber is disposed adjacent to the vacuum vessel so as to be communicated therewith through the opening portion. During film-formation, the interior of the vacuum vessel is maintained in a vacuum state by closing the opening portion with the target while the target exchanging chamber is communicated with the atmosphere and a spare target is contained therein. When exchanging the target, the air in the target exchanging chamber is exhausted to maintain the chamber in a vacuum state and the target is replaced with the spare target.
申请公布号 US5429729(A) 申请公布日期 1995.07.04
申请号 US19900616868 申请日期 1990.11.21
申请人 HITACHI, LTD. 发明人 KAMEI, MITSUHIRO;SETOYAMA, EIJI
分类号 C23C14/34;C23C14/56;(IPC1-7):C23C14/34 主分类号 C23C14/34
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