发明名称 |
A method for mounting a printed circuit board in an EMC screen and an EMC screen |
摘要 |
<p>A printed circuit board (14A) is mounted in an EMC screen (13) with impact extruded pegs which are battered into holes (14B) in the printed circuit board, so that the printed circuit board is pressed against partitions (20) and supporting projections (16). Further the walls (17A) of the screen, particularly shaped to be bendable, are bent over the printed circuit board. The mounting will be robust due to the pegs (15A) and partitions (20) and the forces between the printed circuit board and the bent walls (17B). The grounding is formed between the supporting projections (16), the partitions (20) and the metallisations on the printed circuit board (14A). The pegs (15A) are electrically isolated from the printed circuit board in order to prevent corrosion. Both the bending of the edges (17A) and the battering of the pegs (15A) can be automated. <IMAGE></p> |
申请公布号 |
EP0991308(A2) |
申请公布日期 |
2000.04.05 |
申请号 |
EP19990660154 |
申请日期 |
1999.09.28 |
申请人 |
NOKIA MOBILE PHONES LTD. |
发明人 |
LONKA, PEKKA;KONTKANEN, MIKAEL |
分类号 |
H05K7/14;H05K9/00;(IPC1-7):H05K7/14 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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