发明名称 Semiconductor device with multilayer interconnection having HSQ film with implanted fluorine and fluorine preventing liner
摘要 A semiconductor device with a multilevel interconnection has hydrogen silsesquioxane films which are made porous by etching action of hydrogen fluoride or by ion-implantation of impurities containing fluorine, as an interlayer insulating film for filling up a space between wires. Consequently, a dielectric constant of HSQ is low and wiring capacitance of the multilayer interconnection can be reduced.
申请公布号 US6316833(B1) 申请公布日期 2001.11.13
申请号 US19990305425 申请日期 1999.05.05
申请人 NEC CORPORATION 发明人 ODA NORIAKI
分类号 H01L21/312;H01L21/316;H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L23/48 主分类号 H01L21/312
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