发明名称 Die unit for injection molding
摘要 Disclosed herewith is a die unit for injection molding. The die unit includes first and second dies, which are selectively engaged with each other to form a mold cavity and disengaged from each other to remove a molded product. A first rotating member is rotatably attached to the first die, and provided at its inner end surface with a first helical gear pattern. A second rotating member is rotatably attached to the second die, provided at its inner end surface with a second helical gear pattern, and rotated in a direction opposite to the direction of the first rotating member while the molded product is removed.
申请公布号 US2002098260(A1) 申请公布日期 2002.07.25
申请号 US20010883951 申请日期 2001.06.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JOUNG JEA-HYOK
分类号 B29C45/26;B29C45/44;B29L15/00;(IPC1-7):B29C45/44 主分类号 B29C45/26
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