| 摘要 |
This solid-state image pickup device is provided with: a first substrate wherein photoelectric conversion elements are disposed; a second substrate, which is disposed by being laminated on the first substrate, and in which at least some of peripheral circuits are disposed, said peripheral circuits including a control circuit and a readout circuit for reading out signals based on charges of the photoelectric conversion elements; an electrode section, which is provided in the first substrate, and has a connecting surface that is provided to face the outside of the first substrate such that the connecting surface can be electrically connected; substrate connecting sections, which are disposed between the first substrate and the second substrate, and which electrically connect the first substrate and the second substrate to each other; and an electrostatic protection circuit that is connected to a circuit between the peripheral circuits and substrate connecting sections connected to the electrode section among the substrate connecting sections, said electrostatic protection circuit being in the second substrate. When viewed from the lamination direction in which the first substrate and the second substrate are laminated, the electrostatic protection circuit is disposed at a position where the electrostatic protection circuit does not overlap any one of the substrate connecting sections. |
