| 摘要 |
PURPOSE:To improve the alignment accuracy of a die bonding by utilizing the surface tension of a liquefied solder material and, self-aligning the center of an island for a semiconductor case and the center of a semiconductor pellet. CONSTITUTION:An island 1 is surface-treated by a material having affinity with a liquefied solder material 4. The solder material 4 is dropped onto the island 1. A surface-treated semiconductor chip 5 is placed onto the island 1. The solder material 4 is cured. Consequently, even when the chip 5 is displaced largely and put on a case 10, the chip 5 is moved by the surface tension of the solder material 4, and the center of the island 1 and the center of the chip 5 are self-aligned. Accordingly, the alignment accuracy of die bonding is improved. |
