| 摘要 |
<p>PURPOSE:To obtain a small sized semiconductor device provided with a bump without decreasing the adhesion strength of a bump electrode, by installing the bump electrode on an electrode leading-cut part and a scribing region. CONSTITUTION:A metal film of copper or the like working as an electrode substratum film 5 is formed on a semiconductor substrate 1 on which an aluminum wiring 4 and a protecting film 2 of silicon nitride or the like are formed. Photo resist 6 is spread, baked, exposed, and developed, thereby forming the pattern of a bump electrode so as to lay across a scribing region 10. The bump electrode 7 of gold, copper, solder, etc., is formed by plating method and the like. The photo resist 6 and the electrode substratum film 5 except the bump electrode part are eliminated. After that, the scribing region is scribed together with the bump electrode. A lead terminal 8 from a circuit board 9 and the bump electrode 7 are connected from the lateral direction, and a semiconductor device is mounted on the circuit board.</p> |
